4th Annual ANSYS Innovation Conference

Event Serial66700
Event TypeConferences
Event Date from2019-05-08 to 2019-05-08
Event Categories
Location Ottawa, Canada

Innovation enables organizations to open new avenues of product differentiation by customizing products. In today’s rapidly changing business environment, engineers must innovate quickly to incorporate new features while reducing development costs and delivering new products to the market before the competition. Simulation plays a key role in helping engineers drive innovation, enabling complete virtual prototypes of complex systems to be validated across all physics and engineering disciplines.

Join us as we return to Ottawa for our 4th Annual ANSYS Innovation Conference on May 8, 2019! This one-day conference will provide detailed insight into how leading companies are utilizing simulation to advance their product development. We will bring together ANSYS users, partners, developers, and industry experts for networking, learning, and sharing of new ideas.

What You Will Learn

  • Incorporate various productivity enhancement tools and techniques into your engineering department’s workflow
  • Gain insights into 5G system development with physics-based simulation and cover critical design issues, such as antenna performance, semiconductor reliability, and thermal integrity
  • Identify signal integrity issues early in the design cycle for electronics IC packages, PCBs, connectors and other complex interconnects
  • Modify antenna design, predict antenna efficiency and the overall thermal and EM performance of the product based on electromagnetic and thermal coupling solutions

Agenda

9:15 AM – 9:45 AM
10:00 AM – 10:45 AMSI/PI Simulation Automation: A Growing Opportunity Isaac Waldron, Lead Application Engineer, ANSYS
10:45 AM – 11:30 AMSignal Integrity and Power Integrity analysis with EDA tools Kaisheng Hu, Senior Signal Integrity Engineer, Ciena
11:30 AM – 12:00 PMIsaac Waldron, Lead Application Engineer, ANSYS
12:00 PM – 1:00 PM
Jiaping Zhang, Lead Application Engineer, ANSYSSIwave and Icepak in ANSYS Electronics DesktopIsaac Waldron, Lead Application Engineer, ANSYS
1:45 PM – 2:30 PMExploiting Mainstream PCB Process for 5G Access Point Wenyao Zhai, RF/Microwave/mmWave Design Engineer, HuaweiSemtech

Venue:

Brookstreet Hotel
525 Legget Drive
Ottawa, ON K2K 2W2
Canada

Contact:

Krista Loeffler

WEBSITE:

Click here.

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